Philips Stereo System TDA1574T User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1574T  
Integrated FM tuner for radio  
receivers  
August 1990  
Product specification  
File under Integrated Circuits, IC01  
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
Coil data  
L1: TOKO MC-108, 514HNE-150023S14; L = 0.078 µH  
L2: TOKO MC-111, E516HNS-200057; L = 0.08 µH  
L3: TOKO Coil set 7P, N1 = 5.5 5.5 turns, N2 = 4 turns  
Fig.1 Block diagram and test circuit.  
August 1990  
3
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
PINNING  
1.  
Mixer input 1  
2.  
Mixer input 2  
3.  
Wideband information input  
Ground  
4.  
5.  
Voltage reference  
Oscillator output  
Oscillator input 1  
Oscillator input 2  
Buffered oscillator output  
Not connected  
Not connected  
IF output  
6.  
7.  
8.  
9.  
10.  
11.  
12.  
13.  
14.  
15.  
16.  
17.  
18.  
19.  
20.  
Standby switch  
Narrowband information input  
IF input 1  
IF input 2  
Supply voltage  
Mixer output 1  
Mixer output 2  
AGC output  
Fig.2 Pinning diagram.  
FUNCTIONAL DESCRIPTION  
Mixer  
The mixer circuit uses a double balanced multiplier with a preamplifier (common base input) in order to obtain a large  
signal handling range and low oscillator radiation.  
Oscillator  
The oscillator circuit uses an amplifier with a differential input. Voltage regulation is achieved by utilizing the symmetrical  
tan h-transfer-function to obtain low order 2nd harmonics.  
Linear IF amplifier  
The IF amplifier is a one stage, differential input, wideband amplifier with an output buffer.  
Keyed AGC  
The AGC processor combines narrow and wideband information via an RF level detector, a comparator and an ANDing  
stage. The level dependent current sinking output has an active load which sets the AGC threshold.  
The AGC function can either be controlled by a combination of wideband narrowband information (keyed AGC) or by a  
wideband/narrowband information only. If narrowband AGC is required pin 3 should be connected to pin 5. If wideband  
AGC is required pin 14 should be connected to pin 15.  
August 1990  
4
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134); note 1.  
PARAMETER  
Supply voltage (pin 17)  
CONDITIONS  
SYMBOL  
V17-4  
MIN.  
MAX.  
14  
UNIT  
V
V
Mixer output voltage  
(pins 18 and 19)  
V18,19-4  
35  
Standby switch input voltage  
(pin 13)  
V13-4  
V5-4  
Ptot  
55  
40  
23  
V
V
Reference voltage (pin 5)  
Total power dissipation  
Storage temperature range  
Operating ambient temperature range  
7
500  
+ 150  
+ 85  
mW  
°C  
°C  
Tstg  
Tamb  
Notes to the ratings  
1. All pins are short-circuit protected to ground.  
THERMAL RESISTANCE  
From junction to ambient (in free air)  
Rth j-a = 95 K/W  
August 1990  
5
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
CHARACTERISTICS  
VP = V17-4 = 8.5 V; Tamb = 25 °C; measured in test circuit Fig.1;  
All measurements are with respect to ground (pin 4); unless otherwise specified  
PARAMETER  
Supply (pin 17)  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply voltage  
VP = V17  
V17  
7
14  
V
Supply current  
(except mixer)  
IP = I17  
I17  
V5  
16  
23  
30  
mA  
V
Reference voltage (pin 5)  
4.0  
4.2  
4.4  
Mixer  
DC characteristics  
Input bias voltage  
(pins 1 and 2)  
V1,2  
4
1
V
Output voltage  
(pins 18 and 19)  
Other current  
V18,19  
35  
V
(pins 18 and 19)  
I18 + 19  
4.5  
mA  
fi = 98 MHz  
AC characteristics  
Noise figure  
NF  
9
dB  
Noise figure including  
transforming network  
3rd order intercept point  
Conversion power gain  
Input resistance  
NF  
11  
dB  
EMF1IP3  
GCP  
115  
14  
dB/µV  
dB  
note 1  
(pins 1 and 2)  
R1,2  
14  
13  
Output capacitance  
(pins 18 and 19)  
C18, 19  
pF  
Oscillator  
DC characteristics  
Input voltage  
(pins 7 and 8)  
V7,8  
V6  
1.3  
2
V
V
Output voltage (pin 6)  
AC characteristics  
Residual FM (bandwidth =  
300 Hz to 15 kHz)  
de-emphasis = 50 µs  
f  
2.2  
1.2  
Hz  
V
Linear IF amplifier  
DC characteristics  
Input bias voltage (pin 15)  
V15  
August 1990  
6
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
PARAMETER  
Output voltage (pin 12)  
AC characteristics  
Input impedance  
CONDITIONS  
SYMBOL  
V12  
MIN.  
TYP.  
4.5  
MAX.  
UNIT  
V
fi = 10.7 MHz  
R16-15  
C16-15  
R12  
240  
240  
300  
13  
300  
3
360  
360  
pF  
pF  
dB  
Output impedance  
C12  
Voltage gain  
note 2  
Gv  
27  
30  
Voltage gain with  
variation of temperature  
Tamb = 40  
to + 85 °C  
GT  
0
dB  
1 dB compression point  
(RMS value)  
at VP = 8.5 V  
V12(rms)  
V12(rms)  
S/N  
750  
550  
6.5  
mV  
mV  
dB  
at VP = 7.5 V  
Signal-to-noise ratio  
RS = 300 Ω  
Keyed AGC  
DC characteristics  
Output voltage range  
(pin 20)  
V20  
0.5  
VP0.3  
V
AGC output current  
at I3 = 0 or  
V14 = 450 mV;  
V20 = VP/2  
I20  
25  
2
50  
100  
5
µA  
at V3 = 2 V and  
V14 = 1 V; V20 = V15  
I20  
mA  
Narrowband threshold  
at V3 = 2 V; V14 = 550 mV  
at V3 = 2 V; V14 = 450 mV  
V20  
V20  
1
V
V
VP0.3  
fi = 98 MHz  
AC characteristics  
Input impedance  
R3  
C3  
4
3
kΩ  
pF  
August 1990  
7
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Wideband threshold  
(RMS value)  
(see Figs 3, 4, 5 and 6)  
at V14 = 0.7 V;  
V
20 = VP/2; I20 = 0  
EMF2(rms)  
17  
mV  
Oscillator output buffer  
(pin 9)  
DC output voltage  
Oscillator output voltage  
(RMS value)  
V9  
6
V
at RL = oo; CL = 2 pF  
at RL = 75 Ω  
DC output resistance  
Signal purity  
V9(rms)  
V9(rms)  
R9-17  
30  
110  
50  
mV  
mV  
kΩ  
2.5  
Total harmonic distortion  
Spurious frequencies  
at EMF 1 = 1 V; RS1 = 50 Ω  
THD  
fS  
15  
dB  
dB  
35  
Electronic standby switch  
(pin 11)  
Oscillator; linear IF  
amplifier; AGC  
Tamb = 40  
to + 85 °C  
Input switching voltage  
for threshold ON  
for threshold OFF  
Input current  
V
20 = > VP3 V  
V13  
V13  
0
2.3  
23  
V
V
V20 = < 0.5 V  
3.3  
at ON condition  
at OFF condition  
Input voltage  
V
13 = 0 V  
V13 = 23 V  
13 = 0  
I13  
I13  
V13  
150  
10  
µA  
µA  
V
I
4.4  
Notes to the characteristics  
1. Power gain conversion is equated by the following equation:  
4 (VM (out) 10.7MHz) 2  
(EMF1 98 MHz) 2  
R S1  
10 log  
x
----------------------------------------------------------- ----------  
RML  
2. Voltage gain is equated by the following equation:  
V12  
20 log ------------------  
V16 15  
August 1990  
8
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
Fig.3 Keyed AGC output voltage V20 as a function  
of RMS input voltage V3. Measured in test  
circuit Fig.1 at V14 = 0.7 V; I20 = 0.  
Fig.4 Keyed AGC output voltage V20 as a function  
of input voltage V14. Measured in test circuit  
Fig.1 at V3 = 2 V; I20 = 0.  
Fig.5 Keyed AGC output current I20 as a function  
of RMS input voltage V3. Measured in test  
circuit Fig.1 at V14 = 0.7 V; V20 = 8.5 V.  
Fig.6 Keyed AGC output voltage I20 as a function  
of input voltage V14. Measured in test circuit  
Fig.1 at V3 = 2 V; V20 = 8.5 V.  
August 1990  
9
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
Coil data  
L1: TOKO MC-108, N1 = 5.5 turns, N2 = 1 turn  
L2: see Fig.1  
L3: see Fig.1  
(1) Field strength indication of main IF amplifier.  
Fig.7 TDA1574T application diagram.  
August 1990  
10  
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
PACKAGE OUTLINE  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
0.25  
0.01  
1.27  
0.050  
1.4  
0.25 0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-24  
97-05-22  
SOT163-1  
075E04  
MS-013AC  
August 1990  
11  
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
SOLDERING  
Introduction  
Wave soldering  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream end.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SO  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
August 1990  
12  
 
Philips Semiconductors  
Product specification  
Integrated FM tuner for radio receivers  
TDA1574T  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
August 1990  
13  
 

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