Philips Stereo Amplifier TDA4860 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA4860  
Vertical deflection power amplifier  
for monitors  
1997 Oct 27  
Product specification  
Supersedes data of 1996 Nov 26  
File under Integrated Circuits, IC02  
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
BLOCK DIAGRAM  
TDA4860  
THERMAL AND  
SOAR  
VOLTAGE  
STABILIZER  
VERTICAL  
DRIVER  
FLYBACK  
DRIVER  
PROTECTION  
DIFFERENTIAL  
INPUT  
AMPLIFIER  
VERTICAL  
OUTPUT  
FLYBACK  
GENERATOR  
PULSE  
CIRCUIT  
1
2
3
4
5
6
7
8
9
V
V
V-OUT  
SUB  
FLB  
V
P1  
P2  
P3  
BAX13  
+
8.8 V  
PCO  
5.6 Ω  
470  
µF  
150 kΩ  
270 Ω  
470 µF  
0.1 µF  
R
10 kΩ  
1.8 kΩ  
1.8 kΩ  
PCO  
yoke  
4.3 Ω  
470 µF  
R1  
1 Ω  
from TDA4850  
V
N
1 MΩ  
V-shift  
MHA591  
+
52 V  
8.1 V  
Assumed values:  
Iyoke = 1.42 A.  
Ryoke = 4.17 + 7% + R(T) = 6.12 .  
Lyoke = 5.25 mH.  
R1 = 1.0 ±1%.  
Tamb = 65 °C.  
Tj(max) = 105 °C.  
Tyoke = 75 °C.  
Pyoke = 1.2 W.  
PIC = 1.8 W.  
Ptot = 3.0 W.  
tp FLB = typically 250 µs.  
Attention: the heatsink of the IC must be isolated against ground; the cooling fin is connected to pin 6.  
Fig.1 Block diagram and application circuit with flyback supply voltage VP3 from an external source.  
Deflection frequency range from 50 Hz to 100 Hz.  
1997 Oct 27  
3
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
PINNING  
SYMBOL PIN  
DESCRIPTION  
supply voltage 1  
handbook, halfpage  
V
VP1  
1
2
3
1
2
3
4
5
6
7
8
9
P1  
INP1  
INP2  
VP2  
input 1 of differential input amplifier  
input 2 of differential input amplifier  
INP1  
INP2  
supply voltage 2 for vertical output  
stage  
4
V
P2  
V-OUT  
SUB  
TDA4860  
V-OUT  
SUB  
FLB  
5
6
7
8
9
vertical output  
substrate  
flyback generator output  
flyback supply voltage 3  
pulse circuit output  
FLB  
VP3  
V
P3  
PCO  
PCO  
MHA593  
Fig.2 Pin configuration.  
FUNCTIONAL DESCRIPTION  
Differential input amplifier  
Vertical output  
The vertical output stage is a quasi-complementary  
class-B amplifier with a high linearity. The output contains  
SOAR (short-circuit protection) and thermal protection.  
The output current on pin 5 is reduced for a short time  
(to let the temperature decrease to Tj < 150 °C), when the  
junction temperature (Tj) exceeds 160 °C.  
The differential sawtooth input signal (coming from a ramp  
output of the TDA4850 for example) is fed to the input  
pins 2 and 3. The non-inverted signal is attached to pin 3.  
The vertical feedback signal is superimposed on the  
inverted input signal on pin 2.  
Vertical shift is applied at the inputs in a power-less way  
(see Fig.1).  
Deflection GUARD  
Pin 9 will go HIGH if the junction temperature goes to high  
(see Fig.3). A pulse signal with 50% duty cycle is output on  
pin 9, if the deflection coil is open-circuit. A flyback pulse  
signal is output at normal conditions.  
Flyback generator  
Signals for the flyback generator and the pulse circuit are  
generated in the flyback driver stage. The flyback output  
consists of a Darlington transistor and a flyback diode.  
The flyback generator can operate in two modes:  
Further watching can be achieved by means of an external  
GUARD circuit as shown in Fig.4. The 22 µF capacitor is  
charged during flyback time (V5 > V8) at normal conditions.  
In case of failures, the capacitor is discharged and the  
GUARD output goes HIGH.  
1. An external supply voltage is applied for the short  
flyback time, thus the power dissipation is minimum  
(see Fig.1).  
GUARD output level (see Fig.4):  
2. The flyback voltage is generated by doubling the  
supply voltage (see Fig.5). The 100 µF capacitor C2  
between pins 4 and 7 is charged up to VP1 during  
scan, using the external diode and the resistor R2.  
The cathode of the capacitor C2 is connected to the  
positive rail during flyback. Thus, the flyback voltage is  
twice the supply voltage.  
LOW for normal conditions  
HIGH for deflection coil short-circuit respectively  
open-circuit  
HIGH when there are neither input or output signals.  
1997 Oct 27  
4
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134); voltages referenced to substrate (pin 6); unless  
otherwise specified.  
SYMBOL  
VP1  
PARAMETER  
supply voltage (pin 1)  
CONDITIONS  
MIN.  
MAX.  
40  
UNIT  
V
V
V
V
V
A
A
A
VP2  
VP3  
V2,3,9  
V5,7  
I4  
supply voltage (pin 4)  
60  
supply voltage (pin 8)  
60  
voltage on pins 2, 3 and 9  
voltage on pins 5 and 7  
current on pin 4  
VP1  
60  
1
I5 (M)  
I7 (M)  
I9  
output current on pin 5 (peak value)  
flyback current on pin 7 (peak value)  
current on pin 9  
note 1  
±1.3  
±1.3  
8  
+150  
+75  
168  
±300  
mA  
°C  
°C  
°C  
V
Tstg  
Tamb  
Tj  
storage temperature  
25  
20  
operating ambient temperature  
junction temperature  
note 1  
note 2  
Ves  
electrostatic handling for all pins  
Notes  
1. Internally limited by thermal protection; switching temperature point at 160 ±8 °C.  
2. Equivalent to discharging a 200 pF capacitor through a 0 series resistor.  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-c  
PARAMETER  
VALUE  
UNIT  
thermal resistance from junction to case  
10  
K/W  
The heatsink can be estimated according to application circuit (see Fig.1):  
T
j(max) Tamb  
105 °C 65 °C  
----------------------------------------  
1.8 W  
Rth j-a = Rth j-c + Rth c-h + Rth h-a  
=
=
= 22.2 K/W .  
----------------------------------  
PIC(max)  
A heatsink is needed at Rth j-c < 10 K/W and Rth c-h = 0.5 K/W (using silicon grease) with  
Rth h-a = 22.2 K/W (10 + 0.5) K/W = 11.7 K/W.  
1997 Oct 27  
5
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
CHARACTERISTICS  
VP1 = VP2 = 25 V; VN = V6 = 0 V; Tamb = 25 °C; voltages referenced to substrate (pin 6); unless otherwise specified.  
SYMBOL  
PARAMETER  
supply voltage 1 (pin 1)  
supply voltage 2 (pin 4)  
supply voltage 3 (pin 8)  
supply current (pin 1)  
CONDITIONS  
MIN.  
TYP.  
25  
MAX.  
30  
UNIT  
VP1  
VP2  
VP3  
IP1  
9
9
9
V
V
V
25  
60  
60  
10  
mA  
mA  
IP2  
quiescent supply current (pin 4)  
without input signal  
9
Pre-amplifier  
V2,3  
I2,3  
input voltage (pins 2 and 3)  
input quiescent current  
1.6  
100  
VP1 0.5 V  
nA  
without input signal  
Flyback generator  
V7  
output voltage  
upper value; I7 = 1 A  
VP3 2.2 −  
V
A
I7(M)  
flyback output current  
(maximum value; pin 7)  
±1  
V1-5  
threshold voltage to switch flyback  
flyback pulse time  
on/off threshold  
see Figs 1 and 3  
1.4  
V
tp FLB  
250  
µs  
Vertical output; see Fig.3  
V5  
output voltage  
upper value; I5 = 1 A VP2 2.3 VP2 2  
1.7  
±1  
V
V
A
lower value; I5 = 1 A  
1.5  
I5(M)  
LIN  
vertical output current  
(maximum value; pin 5)  
non-linearity of output signal  
1
%
Pulse circuit output; see Fig.3  
V9  
output voltage  
RPCO = 10 k;  
see Fig.1  
0.4  
VP1 0.4 V  
V9  
output voltage for thermal protection  
active  
VP1 0.4 −  
V
V1-5  
tp9  
voltage to insert flyback pulse on pin 9 normal condition  
pulse width deflection open-circuit −  
normal condition tp FLB  
50  
1.4  
V
%
µs  
1997 Oct 27  
6
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
INP1  
input signal  
on pin 2  
t
INP2  
input signal  
on pin 3  
t
t
= 250 µs  
pFLB  
V-OUT  
output signal  
on pin 5  
t
t
t
PCO  
output signal  
on pin 9 for  
normal condition  
t
p9  
PCO  
50%  
output signal  
on pin 9 for deflection  
unit open-circuit  
PCO  
output signal  
on pin 9 for thermal  
protection active  
t
MEH361  
Fig.3 Vertical timing.  
7
1997 Oct 27  
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
APPLICATION INFORMATION  
V
k
P3  
8
5
V
P
BAX13  
TDA4860  
>1 kΩ  
GUARD output  
HIGH = error  
2.2 Ω  
3.3 kΩ  
BC548  
2N5819  
22 µF  
220 kΩ  
vertical  
output  
signal  
MEH262  
Fig.4 GUARD circuit application on vertical output.  
TDA4860  
THERMAL AND  
VOLTAGE  
STABILIZER  
VERTICAL  
DRIVER  
FLYBACK  
DRIVER  
SOAR  
PROTECTION  
DIFFERENTIAL  
INPUT  
AMPLIFIER  
VERTICAL  
OUTPUT  
FLYBACK  
GENERATOR  
PULSE  
CIRCUIT  
1
2
3
4
5
6
7
8
9
V
V
V-OUT  
SUB  
FLB  
V
P1  
P2  
P3  
BAX13  
C2 100 µF  
PCO  
+
9 V  
5.6 Ω  
470  
µF  
R2 240 Ω  
150 kΩ  
R
270 Ω  
10 kΩ  
PCO  
0.1 µF  
1.8 kΩ  
1.8 kΩ  
5.25 mH  
yoke  
470 µF  
R1  
1 Ω  
from TDA4850  
MHA592  
1 MΩ  
V-shift  
V
N
7.8 V  
Fig.5 Application for flyback voltage generation by doubling the supply voltage.  
8
1997 Oct 27  
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
V
INP1  
2
INP2  
3
V
V-OUT SUB  
V
P3  
PCO  
9
P1  
P2  
1
4
5
6
7
8
cooling fin  
TDA4860  
MEH266  
Fig.6 Internal circuitry.  
1997 Oct 27  
9
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
PACKAGE OUTLINE  
SIL9MPF: plastic single in-line medium power package with fin; 9 leads  
SOT110-1  
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
max.  
A
max.  
2
(1)  
(1)  
E
UNIT  
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5  
17.8  
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
4.4  
4.2  
5.9  
5.7  
2.54  
mm  
3.7  
0.25 1.0  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-25  
SOT110-1  
1997 Oct 27  
10  
 
Philips Semiconductors  
Product specification  
Vertical deflection power amplifier for  
monitors  
TDA4860  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1997 Oct 27  
11  
 
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© Philips Electronics N.V. 1996  
SCA52  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
547047/1200/03/pp12  
Date of release: 1997 Oct 27  
Document order number: 9397 750 02782  
 

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