Intel Computer Hardware BLKDX58SO2 User Manual

Product Brief  
intel® desktop Board dX58So2  
extreme Series  
ATX Form Factor  
Intel® Desktop Board  
DX58SO2 Extreme Series  
efficient optimum state. The massive data  
throughput and support for the Intel Core i7  
processor runs more applications simulta-  
neously, with less wait time.  
and, with superior graphics flexibility,  
gamers enjoy a smoother, more realistic  
experience. Intel® Extreme Memory Profiles  
(Intel® XMP) is a performance-packed  
expansion of the standard DDR3 memory  
specification, enabling a robust and stable  
solution for ultra-fast memory.  
Lock and load!  
Introducing the Intel® Desktop Board  
DX58SO2, designed to unleash the power  
of the new Intel® Core™ i7 processors.  
Power for the hottest new games  
Build upon a winner  
With incredible support for up to 12 threads  
of raw processing power, unprecedented  
bandwidth, triple-channel DDR3 memory,  
and full support for ATI* CrossFireX*  
and NVIDIA* SLI* technologies, the Intel  
Desktop Board DX58SO2 goes where no  
desktop board has gone before.  
With the Intel Desktop Board DX58SO2,  
Intel is breaking down barriers when it  
comes to the performance and bandwidth  
that gamers, digital media creators, and  
ultimate multitaskers need most. The  
Intel Desktop Board DX58SO2 provides  
breakaway performance in production and  
editing, as well as digital media rendering  
and real-time audio/video preview capabili-  
ties. Superior Phase Shedding Technology  
keeps the system performing in the most  
The optimized eight-layer stack up provides  
flawless signal speed and industry-leading  
power delivery to critical components to  
deliver more advanced performance tuning1  
 
Intel® Desktop Board DX58SO2 Extreme Series  
Features and Benefits  
18  
1
Support for the intel® core™ i7  
processor extreme edition in the  
LGA1366 package: Supports both  
four-core and six-core processors. Fea-  
tures Intel® Turbo Boost Technology4  
and Intel® Hyper-Threading Technology5  
for exceptional performance and scal-  
ability, and 12 MB shared Intel® Smart  
Cache, enabling dynamic and efficient  
allocation of cache.  
7
two SAtA 6.0 Gb/s ports, six SAtA  
3.0 Gb/s ports, and two eSAtA back  
ports: Support for up to ten ports with  
external SATA capability and the ability  
to disable individual ports via the Intel®  
Matrix Storage driver stack.  
9
10  
4
12  
5
6
8
9
intel® Matrix Storage technology:  
Performance and reliability with  
support for RAID 0, 1, 5, and 10, and  
new Intel® Rapid Recover Technology.  
15  
16  
14  
2
intel® X58 express chipset with  
icH10r: Features Intel® QuickPath  
Interconnect (Intel® QPI) to the  
processor for 25.6 GB/s maximum  
peak bandwidth.  
Ten-channel Intel® High Definition  
Audio8 (7.1): Enables high-quality  
integrated audio that rivals the perfor-  
mance of high-end discrete solutions.  
1
10 dual intel® Gigabit ethernet LAN:  
Features onboard 10/100/1000 Mb/s  
Ethernet LAN connectivity.  
13  
3
4
Six diMM connectors: Designed to  
support overclocked1 DDR3 1600+6 /  
1333 / 1066 MHz memory, delivering  
up to 48 GB/s7 memory bandwidth.  
11  
11 consumer infrared receiver and  
transmitter: Supports receiving,  
learning, and emitting capabilities,  
controls up to two additional CE  
devices with your PC, and eliminates  
the need for a USB CIR dongle.  
2
3
two SuperSpeed uSB 3.0 ports,  
two ieee 1394a ports (one external  
port and one port via internal  
header), and 12 uSB 2.0 ports (six  
back ports and six ports via three  
internal headers): Provides for the  
most flexible back panel connectivity  
options.  
7
8
17  
12 Back-to-BioS switch: Allows easy  
access to the BIOS for easy overclocking1  
and recovery.  
11.6” (29.46cm)  
13 Post code decoder: Allows for display  
of post codes for debug along with  
the included post code quick reference  
card displaying critical areas to help  
troubleshoot performance-increase  
roadblocks.  
15 Solid-state capacitors and exclusive  
Maximum ePower processor voltage  
regulation design: Maximizes stability  
and power for advanced performance  
tuning.  
17 AtX form factor: ATX board supports  
5
6
three Pci express* 2.0 x16  
connectors: Improved graphics  
bandwidth and support for certified  
triple-card ATI* CrossFireX* and  
NVIDIA* SLI*.  
more fully featured tower designs.  
18 Lead-free: Meets all worldwide  
regulatory requirements for lead-free  
manufacturing.  
16 tweaker switches: Speed bump,  
power, and reset switches for over-  
clocking1 on the go, quick reset, and  
power on.  
Pci express and Pci connectors:  
Flexibility to support PCI Express and  
legacy PCI devices.  
14 exclusive voltage regulator thermal  
solutions: Provides reliable and  
silent cooling for extreme performance  
tuning1.  
3
 
For ordering information, visit www.intel.com  
For the most current product information, visit www.intel.com/go/idb  
Intel® Desktop Board DX58SO2 Extreme Series  
Technical Specifications  
For specific CPU compatibility, visit http://processormatch.intel.com  
ProceSSor  
Hardware Management features  
• Processor fan speed control  
• System chassis fan speed control  
• Voltage and temperature sensing  
• Fan sensor inputs used to monitor fan activity  
• Power management support for ACPI 3.0b  
Memory types  
Storage temperature  
Processor Support  
• DDR3 +1600 / 1333 / 1066 SDRAM memory support  
• Non-ECC Memory  
• -20° C to +70° C  
• Intel® Core™ i7 processors in the LGA1366 package  
• Intel® Turbo Boost Technology4  
• Intel® Hyper-Threading Technology5  
• Integrated Memory Controller with support for up  
to 48 GB7 of system memory DDR3 +16006 /  
1333 / 1066 MHz SDRAM  
reGuLAtioNS ANd SAfetY StANdArdS  
united States and canada  
UL 1950, Third edition—CAN/CSA C22.2  
No. 950-95 with recognized U.S. and Canadian  
component marks  
Memory Modes  
• Triple-, dual-, or single-channel operation support  
Memory Voltage  
• 1.35 V low voltage  
• 1.5 V standard JEDEC voltage  
• Support for Intel® XMP extended voltage profiles  
intel® Pro 10/100/1000 Network connection  
• Dual LAN on the back panel  
• New low-power design can meet Energy Star* 5.0  
specifications  
• Intel® Fast Memory Access  
europe  
• Supports Intel® 64 architecture9  
Nemko certified to EN 60950 International  
Nemko certified to IEC 60950  
(CB report with CB certificate)  
cHiPSet  
JuMPerS ANd froNt-PANeL coNNectorS  
Jumpers  
• Single configuration jumper design  
• Jumper access for BIOS maintenance mode  
expansion capabilities  
intel® X58 express chipset  
• Three PCI Express* 2.0 x16 connectors (configured  
as x16 / x8 / x8 in triple-graphics mode)  
• Two PCI Express 2.0 x1 connectors  
• One PCI connector  
• Intel® 82X58 IOH with ICH10R  
eMc regulations (tested in representative chassis)  
united States  
• Intel® Matrix Storage Manager (RAID 0, 1, 5, 10)  
Two SATA (6.0 Gb/s) ports and 6 SATA (3.0 Gb/s) ports  
• Two eSATA (3.0 Gb/s) ports on the back panel  
FCC Part 15, Class B  
front-Panel connectors  
FCC Part 15, Class B open-chassis (cover off) testing  
• Reset, HD LED, Power LEDs, power on/off  
• Three front-panel Hi-Speed USB 2.0 headers  
• Front-panel audio header  
Audio  
uSB PortS  
canada  
ICES-003, Class B  
• 10-channel Intel® High Definition Audio8 codec  
• 8-channel via the back panel  
• 2-channel via the front panel  
• Back panel support for output via optical cable  
• One internal header for S/PDIF output for HDMI*  
support  
integrated intel® icH10r controller  
• Six Hi-Speed USB 2.0 ports via back panel  
• Six additional Hi-Speed USB 2.0 ports via three  
internal headers  
• One IEEE 1394a header  
europe  
MecHANicAL  
Board Style  
• ATX  
EMC directive 89/336/EEC; EN 55022:1998  
Class B; EN 55024:1998  
• Two SuperSpeed USB 3.0 ports via NEC controller  
Australia/New Zealand  
AS/NZS 3548, Class B  
System BioS  
SYSteM MeMorY  
Memory capacity  
Board Size  
• 9.6” x 11.6” (24.38 cm x 29.46 cm)  
• 32 Mb Flash EEPROM with Intel® Platform  
Innovation Framework for EFI Plug and Play, IDE  
drive auto-configure  
taiwan  
• Six 240-pin DIMM connectors supporting triple-  
channel memory. Two double-sided DIMMs per  
channel.  
Baseboard Power requirements  
• ATX 12 V  
CNS 13438, Class B International  
CISPR 22:1997, Class B  
• Advanced configuration and power interface  
V3.0b, DMI 2.5  
• Maximum system memory up to 48 GB7 using 8 GB  
double-sided DIMMs  
eNViroNMeNt  
operating temperature  
• 0° C to +55° C  
Power requirements vary. Complies with US CRF via  
EN55022 +6 db in system configurations with an  
open chassis and EU Directive 89/336/EEC and use  
via EN55022 and EN50082-1 in a representative  
chassis.  
intel® rapid BioS Boot  
• Intel® Rapid BIOS Boot  
• Intel® Express BIOS update support: BIOS update  
via new F7 function key  
1 Warning: Altering clock frequency and/or voltage may (i) reduce  
system stability and useful life of the system and processor; (ii)  
cause the processor and other system components to fail; (iii)  
cause reductions in system performance; (iv) cause additional  
heat or other damage; and (v) affect system data integrity. Intel  
has not tested, and does not warranty, the operation of the  
processor beyond its specifications.  
2 The Intel® Core Utilities Bundle includes Intel® Integrator Assis-  
tant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel®  
Express BIOS Update.  
3 Intel® Extreme Tuning Utility is only compatible with Intel® Desk-  
top Boards based on the Intel® X38 Express Chipset and newer.  
Auto-tuning capabilities may not be available for all Extreme  
Series motherboards.  
4 Intel® Turbo Boost Technology requires a PC with a processor with  
Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-  
ogy performance varies depending on hardware, software, and  
overall system configuration. Check with your PC manufacturer on  
whether your system delivers Intel Turbo Boost Technology. See  
6 Maximum peak memory bandwidth requires three DDR3 modules  
to be populated in each of the blue memory slots. DDR3 1600  
memory support on this motherboard requires advanced knowl-  
edge of BIOS and memory tuning; individual results may vary.  
For specific supported memory for this motherboard, please visit  
7 System resources and hardware (such as PCI and PCI Express*)  
require physical memory address locations that can reduce avail-  
able addressable system memory. This could result in a reduction  
of as much as 1 GB or more of physical addressable memory being  
available to the operating system and applications, depending on  
the system configuration and operating system.  
8 Intel® High Definition Audio requires a system with an appropriate  
Intel® chipset and a motherboard with an appropriate codec and  
the necessary drivers installed. System sound quality will vary  
depending on actual implementation, controller, codec, drivers,  
and speakers. For more information about Intel® HD Audio, refer  
9 64-bit computing on Intel® architecture requires a computer  
system with a processor, chipset, BIOS, operating system, device  
drivers, and applications enabled for Intel® 64 architecture.  
Processors will not operate (including 32-bit operation) without  
an Intel 64 architecture-enabled BIOS. Performance will vary  
depending on your hardware and software configurations. See  
more information.  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION  
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY  
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY  
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN  
INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,  
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-  
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO  
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY  
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR  
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-  
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.  
Intel products are not intended for use in medical, life-saving,  
or life-sustaining applications. Intel may make changes to speci-  
fications and product descriptions at any time, without notice.  
All products, dates, and figures specified are preliminary based  
on current expectations, and are subject to change without  
notice. Availability in different channels may vary.  
Actual Intel® Desktop Board may differ from the image shown.  
Intel, the Intel logo, and Intel Core are trademarks of Intel  
Corporation in the U.S. and other countries.  
* Other names and brands may be claimed as the property of others.  
Copyright © 2010 Intel Corporation. All rights reserved.  
1110/JB/MS/PDF 324568-001US  
Lead-free: The symbol is used to identify  
electrical and electronic assemblies and com-  
ponents in which the lead (Pb) concentration  
level in any of the raw materials and the end prod-  
uct is not greater than 0.1% by weight (1000 ppm).  
This symbol is also used to indicate conformance  
to lead-free requirements and definitions adopted  
under the European Union’s Restriction on Hazardous  
Substances (RoHS) directive, 2002/95/EC.  
5 Intel® Hyper-Threading Technology requires a computer system  
with a processor supporting HT Technology and an HT Technol-  
ogy-enabled chipset, BIOS, and operating system. Performance  
will vary depending on the specific hardware and software you  
use. For more information including details on which processors  
 

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